When you work with OnBoard Circuits you receive our knowledge and experience, resulting in high quality printed circuit boards and unparalleled customer service. Learn more about our PCB capabilities below.
| Description | Specifications |
|---|---|
| Materials | FR4, Rogers Ultralam 2000, Rogers RO4350, Rogers RO4003, Polyimide, Aluminum, RoHS, CEM-3, Copper, Teflon, Black FR4, Arlon AR350, Getek Copper Clad Thermal Substrates, Hybrid (Rogers and FR4) BT Epoxy, Nelco 4013 |
| Max Layer Count | 80 Layers |
| Max Board Size | 32.00″ x 26.50″ |
| Min Cu Foil Thickness | 1/3 oz |
| Max Cu Foil Thickness | 12 oz |
| Min Dielectric Thickness | 0.004″ |
| Min Board Thickness | 0.005″ |
| Max Board Thickness | 0.25″ |
| Board Thickness Tolerance (%) | +/- 0.005″ |
| Layer to Layer Registration | +/- 0.0025″ |
| Impedance Control (+/- %) | +/- 10% |
| Max Warpage | 0.006″ |
| Flex and Rigid Flex Boards | Available |
| Image | |
| Min Trace Width | 0.004″ |
| Min Space Width | 0.004″ |
| Min Annular Ring | 0.004″ |
| SMD Pitch | 0.012″ |
| BGA Pitch | 0.02″ |
| Pattern Plating | OK |
| Solder Mask | |
| Min Solder Mask Dam | 0.004″ |
| Solder Mask Clearance | 0.004″ |
| Min SMT Pad Spacing | 0.006″ |
| Solder Mask Thickness | 0.0007″ |
| Holes | |
| Min Hole Size | 0.005″ |
| Max Hole Size | 0.257″ |
| Hole to Hole Space | 0.01″ – 0.008″ |
| Hole Size Tol (+/-) | +/- 0.002″ |
| Aspect Ratio | 12:01 |
| Hole Registration | 0.002″ |
| Via on PTH | OK |
| Via in Pad | OK |
| Plating | |
| Finishes | HASL-LF/HASL, Immersion Gold, Immersion Silver, Immersion White Tin, Electrolytic Hard Gold |
| HASL-LF/HASL | 0.3μ” – 0.34μ” |
| Immersion Tin | 0.030μ” – 0.050μ” |
| Immersion Gold | 0.002μ” – 0.003μ” |
| Gold Fingers | 0.030μ” – 0.050μ” |
| Nickel Plating | 0.15μ” – 0.2μ” |
| Electrolytic Hard Gold | 0.067μ” |
| Outline | |
| Tooling Hole to Routed Edge Registration (+/-) | +/- 0.005″ |
| Panel Outline Tol (+/-) | 0.008″ |
| Guide Rail | 0.4″ |
| Beveling | 20°, 30°, 45° |
| Beveling Tolerance | +/-0.008″ |
