Our PCB Fabrication Capabilities

Description	Specification
	General - Inch (mm)	Advanced - Inch (mm)
Material	FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) / Polyimide
Max Layer Count	40 Layers
Min Cu Foil Thickness	1/3 oz (12)
Min Dielectric Thickness	0.004" (0.1mm)
Via Hole Plugging
Min Board Thickness (a)	0.015"(0.4mm)
Max Board Thickness (b)	0.25"(6.4mm)
Board Thickness Tolerance (%)	±10% ~ ±5%
Layer to Layer Registration	±0.005" (±0.127mm )	±0.004" (±0.1mm)
Impedance Control (+/- %)	±10%
Max Warpage	0.008" (0.2mm)	0.006" (0.15mm)
Image
Min Trace Width (a)	0.006"(0.15mm)	0.004"(0.1mm)
Min Space Width (b)	0.005"(0.127mm)	0.004"(0.1mm)
Min Annular Ring	0.006"(0.15mm)	0.004"(0.1mm)
SMD Pitch (a)	0.02"(0.5mm)	0.012"(0.3mm)
BGA Pitch (b)	0.03"(0.8mm)	0.02"(0.5mm)
Pattern Plating	OK
Solder Mask
Min Solder Mask Dam (a)	0.006"(0.15mm)	0.004"(0.1mm)
Soldermask Clearance (b)	0.006"(0.15mm)	0.004"(0.1mm)
Min SMT Pad spacing (c)	0.007"(0.18mm)	0.006"(0.127mm)
Solder Mask Thickness	0.0007"(0.018mm)
Holes
Min Hole Size (a)	0.008"(0.2mm)
Max Hole Size (a)	0.257"(6.5mm)
Hole to Hole Space (b)	0.01" ~ 0.008"(0.254 ~ 0.2mm)
Hole Size Tol (+/-)	±0.003"(±0.0762mm)	±0.002"(±0.05mm)
Aspect Ratio	'10 : 1	'12 : 1
Hole Registration	0.002"(0.05mm)
Via on PTH	OK
Via in Pad	OK
Plating
HASL	0.3u"~0.34u" (7.0 ~ 8.0)
Immersion Tin	0.030u"~0.050u" (0.762 ~ 1.27)
Immersion Gold	0.002u"~0.003u" (0.05 ~ 0.0762)
Gold Finger	0.030u"~0.050u" (0.762 ~ 1.27)
Nickel Plating	0.15u"~0.2u" (3.81 ~ 5.08)
Electrolityc Hard Gold	0.067u" (1.7)
Outline
Tooling Hole to Routed Edge Registration (+/-)	±0.005" (± 0.127)
Panel Outline Tol (+/-)	0.008" (0.2)
Guide Rail	0.4" (10mm)
Beveling	20, 30', 45'
Panel
Max Size	27.6" x 23.6" (700mm x 600mm)